Continued demand for mature- and mid-node production: Many analog, power, sensor and packaging layers continue to be manufactured using DUV (28–65 nm and larger), maintaining persistent equipment ...
DUV will be the primary driver of growth for ASML in 2023 and 2024 on strong customer demand. EUV sales face short-term headwinds and customer delays. ASML's long-term goals of bringing high-NA EUV to ...
A team led by Prof. SUN Haiding from the University of Science and Technology of China (USTC) developed a vertically integrated micro-scale light-emitting diode (micro-LED) array，which was then ...
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