AGC Inc., Schott AG, Corning Incorporated, Nippon Sheet Glass Co., Ltd., and HOYA Corporation were identified as star players in the glass substrate market, as they have focused on advanced material ...
Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...
Solvents and substrates are the bread and butter of wet-lab chemistry. But the sheer diversity of research activities, be it ...
No matter what, it's clear at this point that the way forward for the semiconductor industry is chiplets, or "tiles" in Intel nomenclature. Piling multiple pieces of a processor onto one package ...
CHAMPAIGN, Ill. — A new artificial intelligence-powered tool can help researchers determine how well an enzyme fits with a desired target, helping them find the best enzyme and substrate combination ...
In a nutshell: TSMC is venturing into uncharted territory with a novel approach to advanced chip packaging. The chipmaker reportedly plans to switch from conventional round wafers to rectangular ...
The big picture: Most expect that by the end of the decade, the semiconductor industry will hit a wall in terms of being able to scale transistors on silicon using organic materials. Scaling is key to ...
A recent article published in RSC Applied Polymers proposed re-processible electronic substrates based on photopolymerizable polyimides to mitigate electronic waste (e-waste). These high-performance, ...
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